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Silver Bonding Wire
Pureté : ≥99.95%, ou personnalisée
Diameter: ≥0.018 mm, or customized
Silver Bonding Wire is a high-performance conductive material specially designed for the packaging and electrical connections of electronic components. It is made from high-quality silver and silver alloy through special techniques, offering extremely low electrical resistance and excellent oxidation resistance. As a leading supplier and manufacturer of premium silver products, Heeger Metal leverages advanced technology to deliver high-quality silver bonding wires for various applications.
Ou envoyez-nous un courriel à l'adresse suivante max@heegermaterials.com.Silver Bonding Wire Data Sheet
| Code de référence : | HMSI2709 |
| CAS : | 7440-22-4 |
| La pureté : | ≥99.95%, ou sur mesure |
| Densité : | 10.503 g/cm3 |
| Point de fusion : | 961.78℃ |
| Point d'ébullition : | 2162℃ |
| Diamètre : | ≥0.018 mm, or customized |
| Tempérer : | Recuit ou non recuit |
Silver Bonding Wire Description
Silver Bonding Wire is made from high-purity silver (5N and above) and utilizes proprietary alloying casting and processing technologies. This effectively addresses issues such as rapid diffusion of silver-aluminum intermetallic compounds and performance degradation, while significantly enhancing corrosion resistance, making it an excellent alternative to fil d'or. Silver bonding wire is widely used in integrated circuits and semiconductor devices, and slightly thicker wires can also be used to manufacture audio cables. As a metal bonding material, Heeger Metal provides bonding wires in gold (Au), silver (Ag), copper (Cu), and aluminum (Al), with fine wires (10-38μm) and thicker wires (100-500μm) for power devices. In addition to offering wire with smooth, clean surfaces and good dimensional stability, we also provide comprehensive solutions and expertise in metal bonding.
Silver Bonding Wire Composition and Characteristics
| Type | YA1 | YA2 | YA3 | YA4 |
| Main content | Ag≥99.0% AuPd≤1.0% | Ag≥95.0% AuPd≤5.0% | Ag≥88.0% AuPd≤12.0% | Ag≥85.0% AuPd≤15.0% |
| Characteristics | Low electrical resistivity high thermal conductivity | Bonne résistance à la corrosion | good corrosion resistance | Good fatigue resistance |
Silver Bonding Wire Specifications and Mechanical Properties
| Diamètre | B/L(gf) | E/L(%) | ||||
| μm | mil | YA1 | YA2 | YA3 | YA4 | YA |
| 15±1 | 0.6 | >1.5 | >2 | >3 | >4 | 2 – 10 |
| 16±1 | 0.65 | >2 | >3 | >4 | >5 | 2 – 10 |
| 18±1 | 0.7 | >4 | >5 | >6 | >7 | 5 – 15 |
| 20±1 | 0.8 | >5 | >6 | >7 | >8 | 5 – 15 |
| 23±1 | 0.9 | >7 | >8 | >10 | >11 | 5- 15 |
| 25±1 | 1.0 | >9 | >10 | >12 | >13 | 5- 15 |
| 30±1 | 1.2 | >13 | >14 | >15 | >16 | 8- 18 |
| 32±1 | 1.25 | >15 | >16 | >17 | >18 | 8 – 18 |
| 38±1 | 1.5 | >20 | >21 | >22 | >23 | 10 – 20 |
| 50±2 | 2.0 | >34 | >36 | >38 | >40 | 10 – 20 |
| 75±3 | 3.0 | >68 | >70 | >75 | >78 | 15 – 25 |
Silver Bonding Wire Fusing Current and Hardness
| Type | YA1 | YA2 | YA3 | YA4 | ||
| μm | mil | |||||
| Fusing Current (A,10mm) | 18 | 0.7 | 0.38 | 0.35 | 0.32 | 0.30 |
| 20 | 0.8 | 0.49 | 0.45 | 0.42 | 0.39 | |
| 23 | 0.9 | 0.62 | 0.57 | 0.53 | 0.48 | |
| 25 | 1.0 | 0.76 | 0.70 | 0.64 | 0.61 | |
| 30 | 1.2 | 1.07 | 0.99 | 0.91 | 0.89 | |
| 38 | 1.5 | 1.66 | 1.54 | 1.42 | 1.37 | |
| 50 | 2.0 | 2.91 | 2.74 | 2.52 | 2.43 | |
| Dureté (Hv) | Fil de fer | 56-61 | 59-64 | 61-66 | 63-68 | |
| FAB | 50-55 | 53-58 | 55-59 | 56-60 | ||
Silver Bonding Wire Features
- Excellente conductivité
- Excellent heat dissipation
- Good reflectivity
- Good solderability
Silver Bonding Wire Applications
Silver Bonding Wire plays a crucial role in connecting chips with circuits, packaging optoelectronic devices, and transmitting signals in sensors, ensuring efficient and stable electrical connections between electronic components. The application fields include semiconductor packaging, integrated circuit connections, optoelectronic device packaging, sensors, and automotive electronics. Here are the specific applications of every type:
| YA1 | YA2 | YA3 | YA4 |
| Common | LED TR IC CARD QFN TSOP Flash Memo | LED QFP TSSOP QFN DFN IC CARD MQFP PBGA TQFP BGA Flash Memo | TQFP TSSOP PBGA BGA |
Silver Bonding Wire Packaging
Silver Bonding Wire is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
Silver Properties
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