Cible de pulvérisation de zirconium

Zirconium Sputtering Target Material Composition

Matériau	Composition chimique
	Zr+Hf	Sn	Fe	Cr	Ni	Hf	Nb
Zr 702	~99.5%	/	<0,05%	<0,05%	/	1~2.5%	/
Zr 704	~97.5%	1~2%	0.1~0.2%	0.1~0.2%	/	<4.5%	/
Zr 705	~95.5%	1~2%	<0,05%	<0,01%	/	<4.5%	2~3%
Zircaloy-2	~98%	1.2~1.7%	0.07~0.2%	0.05~0.15%	0.03~0.08%	<200ppm (pour l'industrie nucléaire)	/
Zircaloy-4	~98%	1.2~1.7%	0.07~0.2%	0.05~0.15%	<0,007%	<200ppm (pour l'industrie nucléaire)	/

Zirconium Sputtering Target Specifications

Material Type	Zirconium	Theoretical Density (g/cc)	6.49
Symbol	Zr	Z Ratio	0.6
Atomic Weight	91.224	Sputter	DC
Atomic Number	40	Max Power Density (Watts/Square Inch)	50*
Color/Appearance	Silvery White, Metallic
Thermal Conductivity	22.7 W/m.K	Type of Bond	Indium, Elastomer
Point de fusion (°C)	1,852	Comments	Alloys with W. Films oxidize readily.
Coefficient of Thermal Expansion	5.7 x 10-6/K

Zirconium Sputtering Target Stock Dimensions

Circular Sputtering Targets	Diamètre	1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21”
Rectangular Sputtering Targets	Width x Length	5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20”
Épaisseur		0.125”, 0.25”

Zirconium Sputtering Target Advantages

• High Melting Point: With a melting point of 1852°C, zirconium has excellent thermal stability. In high-temperature environments, zirconium sputtering targets are resistant to melting or deformation, ensuring smooth thin film deposition and other processes, which enhances product quality and process stability.
• Chemical Stability: Zirconium sputtering targets are highly resistant to the erosion of various chemicals, offering exceptional stability in demanding environments.
• Résistance à la corrosion: Zirconium exhibits outstanding corrosion resistance in acidic and salt spray conditions, significantly extending the lifespan of the material.
• Density and Hardness: With a density of approximately 6.51 g/cm³, zirconium provides excellent mechanical stability. It also possesses good hardness, allowing it to withstand abrasion and mechanical shocks.
• Thermal Conductivity: Zirconium has a high thermal conductivity of around 22 W/m·K, which efficiently dissipates heat during use, contributing to improved performance and longevity.

Zirconium Sputtering Target Production Process

The production process of zirconium sputtering targets is a complex process that demands strict control over parameters and quality at each stage to ensure optimal performance. It mainly includes the following steps:

• Raw Material Preparation: Selecting high-purity zirconium materials is the first step in preparing high-quality zirconium sputtering targets.
• Melting: An electric arc or induction furnace melts raw materials at high temperatures to produce metallic zirconium. Strict control of furnace temperature, atmosphere, and protective gas flow is essential to prevent oxidation and impurities, ensuring melt purity and uniformity.
• Casting: After melting, the zirconium metal is cast into ingots through molds. The casting process needs to be carried out in a high-purity inert gas environment to prevent oxidation and impurity contamination.
• Roulant: The cast zirconium ingot undergoes rolling to achieve the required thickness and shape. Repeated heating and cooling improve material density and uniformity, while precise control of temperature and rolling force prevents defects like cracks and deformation.
• Traitement de surface: Zirconium sputtering targets undergo surface treatment to remove oxide layers and impurities, using methods like chemical polishing, which removes contaminants through chemical reactions, and mechanical polishing, which improves surface finish and flatness using abrasives.
• Contrôle de la qualité: Advanced testing equipment and techniques assess the purity, composition, density, uniformity, appearance, and dimensional accuracy of the target material to ensure it meets production standards and customer requirements.

Zirconium Sputtering Target Applications

• Microelectronics and Semiconductor Manufacturing: Zirconium films, deposited by magnetron sputtering, are used in semiconductor devices to improve performance and stability, such as reducing leakage current in high-frequency and high-power devices.
• Optics and Photovoltaic Field: Zirconium films, deposited by magnetron sputtering, enhance anti-reflective properties and light transmittance in optical devices, improving imaging quality. Photovoltaic devices like solar cells, boost conversion efficiency and ensure accurate light detection under varying conditions.
• Hard Coatings: Zirconium thin films on tools and mechanical parts improve wear and corrosion resistance, enhancing performance and extending service life in high-wear environments like cutting tools, drills, and pumps. This reduces maintenance, lowers costs, and boosts durability and reliability.
• Decorative Coatings: Zirconium thin films, available in various colors and glosses, are used for surface decoration in architecture, furniture, and electronics. They enhance aesthetics while providing added protection against wear and corrosion on surfaces like glass, panels, and electronics.

Zirconium Sputtering Target Packaging

The Zirconium Sputtering Target is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.