Gold Bonding Wire

Gold Bonding Wire

Gold Bonding Wire

Purity: ≥99.95%, or customized

  • Custom sizes and standard sizes in stock
  • Quick Lead Time
  • Competitive Price
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5 星级
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5 星级
5 星级

Gold Bonding Wire is a high-performance wire used in the semiconductor industry to create electrical connections between microchips and their packaging. As a leading supplier and manufacturer of premium gold products, Heeger Metal leverages advanced technology to deliver high-quality gold bondingwires for various applications.

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Or email us at max@heegermaterials.com.

Gold Bonding Wire Data Sheet

Reference Code:HMGO2723
CAS:7440-57-5
Purity:≥99.95%, or customized
Density:19.283 g/cm3
Melting Point:1064℃
Boiling Point:2970℃
Temper:Annealed or Unannealed

Gold Bonding Wire Description

Gold (Au) has excellent conductivity, chemical stability, and malleability, making it invaluable for various applications. Gold Bonding Wire is made of high-purity gold metal with a maximum purity of 99.999% (5N). It has excellent electrical conductivity, corrosion resistance, and malleability, making it mainly used in wire bonding applications for integrated circuits (ICs), and other microelectronic components. The gold bonding wire ensures a strong and reliable connection. Heeger Metal can supply high-quality gold bonding wires in various diameters and lengths to suit industrial and research applications, ensuring optimal performance and cost-effectiveness.

  • Gold Bonding Wire

Gold Bonding Wire Chemical Composition

ElementContent (wt%)CAS No.
Gold (Au)99.99%7440-57-5
Silver (Ag)0.0015%7440-22-4
Iron (Fe)0.0010%7439-89-6
Lead (Pb)0.0005%7439-92-1
Magnesium (Mg)0.0005%7439-95-4
Copper (Cu)0.0015%7440-50-8
Silicon (Si)≤0.0010%7440-21-3
Other≤0.0040%—

Gold Bonding Wire Specifications

Diameter (μm)Elongation (%)Weight per 500 meters (g)Breaking Load (cN)  
G1G2G3
18±12.0-5.02.457＞2.5＞4.0＞5.0
20±12.0-6.03.033＞4.0＞5.0＞6.0
23±12.0-7.04.011＞5.5＞7.0＞8.0
25±12.0-8.04.739＞7.5＞9.0＞10.0
28±12.0-8.05.945＞9.0＞12.0＞13.0
30±13.0-8.06.825＞11.0＞13.0＞15.0
32±13.0-8.07.765＞12.0＞15.0＞16.0
33±13.0-8.08.258＞13.0＞16.0＞18.0
35±13.0-10.09.289＞15.0＞18.0＞20.0
38±13.0-10.010.950＞18.0＞21.0＞22.0
40±13.0-10.012.133＞20.0＞24.0＞26.0
45±13.0-12.015.356＞25.0＞28.0＞30.0
50±23.0-12.018.958＞30.0＞34.0＞36.0
60±37.0-14.027.299＞45.0＞50.0＞52.0
70±37.0-14.037.157＞55.0＞60.0＞63.0
75±37.0-14.042.655＞65.0＞65.0＞68.0

Gold Bonding Wire Advantages

  • Extreme bond reliability
  • Wide processing window
  • Low-impact ball and wedge bonding
  • Superior looping performance
  • High-tensile test performance
  • Excellent corrosion-resistance
  • Ultra-fine pitch
  • A variety of spool sizes

Gold Bonding Wire Applications

  • Semiconductor Packaging: Gold bonding wire is used to connect the integrated circuit (IC) to the lead frame in semiconductor devices. It ensures high-performance and long-lasting electrical connections.
  • LED Packaging: In LED technology, gold wire is used to bond the LED chip to the frame, ensuring a stable and reliable electrical connection.
  • Microelectronics: Gold bonding wire is essential for wire bonding in microelectronics, providing strong and conductive connections for small-scale electronic components.
  • Automotive Electronics: Gold wire is used in automotive electronics for its durability and resistance to extreme conditions, ensuring long-term reliability in critical systems like sensors and control units.
  • Medical Devices: Gold bonding wire is used in medical devices, including pacemakers and other implants, due to its biocompatibility and reliability over long periods.
  • Aerospace: In aerospace applications, gold wire is used for its robustness and ability to perform in high-stress and high-temperature environments.
  • Consumer Electronics: Gold bonding wire is also used in consumer electronics such as smartphones, tablets, and wearables, where reliable and long-lasting connections are crucial.

Gold Bonding Wire Packaging

Gold Bonding Wire is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Metal Packing

Gold Properties

ElementValue
Atomic number79
Crystal structureFace centred cubic
Electronic structureXe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown1,3
Atomic weight( amu )196.9665
Thermal neutron absorption cross-section( Barns )98.8
Photo-electric work function( eV )4.8
Atomic radius – Goldschmidt( nm )0.144
Ionisation potential( No./eV )1/ 9.22
Ionisation potential( No./eV )2/ 20.5
ElementValue
Material conditionSoft
Material conditionHard
Poisson’s ratio0.42
Poisson’s ratio0.42
Bulk modulus( GPa )171
Bulk modulus( GPa )171
Tensile modulus( GPa )78.5
Tensile modulus( GPa )78.5
Hardness – Vickers( kgf mm⁻² )20-30
Hardness – Vickers( kgf mm⁻² )60
Tensile strength( MPa )130
Tensile strength( MPa )220
Yield strength( MPa )205
Yield strength( MPa )–
ElementValue
Electrical resistivity( µOhmcm )2.20@20@20°C
Temperature coefficient( K⁻¹ )0.004@0-100°C
Thermal emf against Pt (cold 0C – hot 100C)( mV )0.74
ElementValue
Boiling point( C )3080
Density( gcm⁻³ )19.3@20°C
ElementValue
Melting point(℃)1064.4
Latent heat of evaporation( J g⁻¹ )1738
Latent heat of fusion( J g⁻¹ )64.9
Specific heat( J K⁻¹ kg⁻¹ )129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )14.1@0-100°C

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To customize your gold bonding wire, please provide the following details:

  1. Diameter (for the wire)
  2. Length (indicate the length you need)
  3. Form (straight, coiled, or spooled)
  4. Purity of the material
  5. Surface Finish (e.g., polished, rough, oxide-coated, etc.)
  6. Quantity of the products you need
  7. Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of gold products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific platinum materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Metal, we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

A gold bonding wire is made of high-purity gold, used primarily in the semiconductor and microelectronics industries to create electrical connections between different parts of an electronic component, such as between a semiconductor chip and its package.

Gold bonding wire is primarily used for interconnecting semiconductor chips to lead frames in IC packaging due to its excellent conductivity and reliability.

Heeger Metal, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of gold products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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