Cible de pulvérisation de molybdène

Molybdenum Sputtering Target Material Chemical Composition

Matériau	Mo	Impurities, (≤%）
		Al	Ca	Fe	Mg	Ni	Si	C	N	O	La2O3
Mo1	Bal.	0.002	0.002	0.010	0.002	0.005	0.01	0.01	0.003	0.008	–
Mo2	Bal.	0.005	0.004	0.015	0.005	0.005	0.01	0.02	0.003	0.020	–
MoLa	Bal.	0.002	0.002	0.015	0.005	0.005	0.01	0.02	0.005	–	0.1~1.8
Note: The O content of MoLa alloy can be tested according to customer requirements.

Molybdenum Sputtering Target Specifications

Material Type	Molybdène	Coefficient of Thermal Expansion	4.8 x 10-6/K
Symbol	Mo	Theoretical Density (g/cc)	10.2
Atomic Weight	95.96	Z Ratio	0.257
Atomic Number	42	Sputter	DC
Color/Appearance	Grey, Metallic	Max Power Density (Watts/Square Inch)	150*
Thermal Conductivity	139 W/m.K	Type of Bond	Indium, Elastomer
Point de fusion (°C)	2,617	Comments	Films smooth, hard.

Molybdenum Sputtering Target Stock Dimensions

Circular Sputtering Targets	Diamètre	1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″
Rectangular Sputtering Targets	Width x Length	5″ x 12″ 5””x 15″ 5″ x 20″ 5″ x 22″ 6″ x 20″
Épaisseur		0.125″, 0.25″

Molybdenum Sputtering Target Production Process

Generally prepared using the powder metallurgy method, the purity of molybdenum powder should be above 99.95%. The specific process is as follows:

• Put the poudre de molybdène in the vacuum heat treatment furnace for pre-gassing, then introduce hydrogen and continue heating for degassing.
• The degassed molybdenum powder is sintered once by vacuum hot pressing.
• The primary sintered product is passed through a hot isostatic press to complete the secondary sintering.
• After the secondary sintering, the whole surface of the product is ground by machining to get the final product.

Molybdenum Sputtering Target Features

• High Purity: Up to 99.99% purity
• High Density: Density close to the theoretical density of 10.22 g/cm3
• Uniform Microstructure: Ensuring uniform erosion during the sputtering process
• Small Average Grain Size: Ensuring the uniformity of the target

Molybdenum Sputtering Target Applications

• Semiconductor Manufacturing: Molybdenum sputtering targets are used to deposit conductive and shielding layers, especially in producing integrated circuits and microelectronic devices.
• Flat Panel Displays: Molybdenum sputtering targets are used to form electrodes and wiring materials in displays such as TFT-LCDs (thin-film transistor liquid crystal displays) and OLEDs (organic light-emitting diodes).
• Thin-Film Solar Cells: Molybdenum sputtering targets are used in the back-electrode layer of CIGS (copper indium gallium selenide) thin-film solar cells to improve the efficiency and stability of the cells.
• Medical Imaging Equipment: Molybdenum sputtering targets are used in X-ray tubes to generate high-quality X-rays and ensure the clarity and stability of imaging.
• Glass Coating: Molybdenum sputtering targets are used for coating glass surfaces to enhance the wear resistance and corrosion resistance of glass.

Molybdenum Sputtering Target Packaging

The Molybdenum Sputtering Target is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.