Gold Sputtering Target

Gold Sputtering Target

Gold Sputtering Target

Purity: ≥99.95%, or customized

  • Custom sizes and standard sizes in stock
  • Quick Lead Time
  • Competitive Price
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Gold Sputtering Target is made of high-purity gold metal through precise techniques and is designed for thin-film deposition processes. It is available in various sizes and forms to suit different sputtering systems. As a leading supplier and manufacturer of premium gold products, Heeger Metal leverages advanced technology to deliver high-quality gold sputtering targets for various applications.

Or email us at max@heegermaterials.com.

Gold Sputtering Target Data Sheet

Reference Code:HTST288
CAS:7440-57-5
Purity:≥99.95%, or customized
Density:19.283 g/cm3
Melting Point:1064℃
Boiling Point:2970℃
Shape:Disc, Rectangular, Tube, or customized
Boding:Bonding or Unbonding

Gold Sputtering Target Description

Gold (Au) has excellent conductivity, chemical stability, and malleability, making it invaluable for various applications. Gold Sputtering Target is made of high-purity gold metal, designed for thin-film deposition processes. With its stable performance and consistent quality, our gold sputtering target ensures smooth, uniform coatings for solar cells, sensors, and precision instruments. Heeger Metal can supply high-quality gold sputtering targets in various specifications and customized solutions to suit industrial and research applications, ensuring optimal performance and cost-effectiveness.

Gold Sputtering Target Specifications

SymbolAu
Atomic Weight196.966569
Atomic Number79
Color/AppearanceGold, Metallic
Thermal Conductivity320 W/m.K
Melting Point (°C)1,064
Coefficient of Thermal Expansion14.2 x 10-6/K
Theoretical Density (g/cc)19.32
Z Ratio0.381
SputterDC
Max Power Density
(Watts/Square Inch)
100*
Type of BondIndium, Elastomer
CommentsFilms soft; not very adherent.

Gold Sputtering Target Stock Dimensions

Circular Sputtering TargetsDiameter1.0″
2.0″
3.0″
4.0″
5.0″
6.0″
up to 21″
Rectangular Sputtering TargetsWidth x Length5″ x 12″
5””x 15″
5″ x 20″
5″ x 22″
6″ x 20″
Thickness0.125″, 0.25″

Gold Sputtering Target Applications

  • Semiconductor Industry: Gold sputtering targets are used to produce microelectronic components, including integrated circuits, sensors, and connectors, providing excellent conductivity and reliability.
  • Thin-Film Coatings: Commonly used in producing thin gold films for optical coatings, enhancing reflectivity and durability.
  • Solar Cells: Gold sputtering is employed in making thin-film solar cells to improve efficiency and performance.
  • Optical Devices: Used to create reflective coatings for optical lenses, mirrors, and other devices, ensuring high-quality light transmission and reflection.
  • Biomedical Applications: Gold sputtering targets are used in the manufacturing of bio-compatible coatings for medical devices, such as implants and sensors, due to their biocompatibility and non-reactivity.
  • Display Technology: Gold thin films are utilized in manufacturing advanced display technologies, including flat-panel displays and touch screens.
  • Sensors: Gold coatings are applied to sensors for their excellent conductive properties, ensuring high sensitivity and accuracy in applications such as gas sensors, biosensors, and chemical sensors.

Gold Sputtering Target Packaging

Gold Sputtering Target is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Metal Packing

Gold Properties

ElementValue
Atomic number79
Crystal structureFace centred cubic
Electronic structureXe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown1,3
Atomic weight( amu )196.9665
Thermal neutron absorption cross-section( Barns )98.8
Photo-electric work function( eV )4.8
Atomic radius – Goldschmidt( nm )0.144
Ionisation potential( No./eV )1/ 9.22
Ionisation potential( No./eV )2/ 20.5
ElementValue
Material conditionSoft
Material conditionHard
Poisson’s ratio0.42
Poisson’s ratio0.42
Bulk modulus( GPa )171
Bulk modulus( GPa )171
Tensile modulus( GPa )78.5
Tensile modulus( GPa )78.5
Hardness – Vickers( kgf mm⁻² )20-30
Hardness – Vickers( kgf mm⁻² )60
Tensile strength( MPa )130
Tensile strength( MPa )220
Yield strength( MPa )205
Yield strength( MPa )
ElementValue
Electrical resistivity( µOhmcm )2.20@20@20°C
Temperature coefficient( K⁻¹ )0.004@0-100°C
Thermal emf against Pt (cold 0C – hot 100C)( mV )0.74
ElementValue
Boiling point( C )3080
Density( gcm⁻³ )19.3@20°C
ElementValue
Melting point(℃)1064.4
Latent heat of evaporation( J g⁻¹ )1738
Latent heat of fusion( J g⁻¹ )64.9
Specific heat( J K⁻¹ kg⁻¹ )129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )14.1@0-100°C

Get A Quote

We will check and get back to you in 24 hours.

To customize your gold sputtering target, please provide the following details:

  1. Diameter (for the circular sputtering targets)
  2. Width × Length (for the rectangular sputtering targets)
  3. Thickness (for the sputtering targets)
  4. Backing Plate (If bonding service is required, please specify the material and dimensions of the backing plate.)
  5. Purity (Specify the purity of material required.)
  6. Quantity of the products you need
  7. Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of gold products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific gold materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Metal, we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

A gold sputtering target is a high-purity gold disc or plate used in deposition processes to create thin gold coatings for electronics, optics, and medical devices.

High-quality gold sputtering targets typically have 99.99% (4N) to 99.999% (5N) purity to ensure minimal impurities during sputtering.

Gold sputtering targets are primarily used in semiconductor chips, solar cells, MEMS, and biomedical sensors for conductive/reflective layers.

Heeger Metal, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of gold products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Sputtering Targets Products

Heeger Metal offers a wide selection of high-performance sputtering targets made from materials like titanium, copper, aluminum, and rare earth metals. Our custom sputtering targets are precision-engineered to meet the demands of industries such as semiconductor manufacturing, photovoltaics, and electronics. With superior purity and consistency, our sputtering targets deliver exceptional film deposition performance, making them ideal for thin-film coating, sputtering, and PVD (Physical Vapor Deposition) applications.

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