Silver Bonding Wire

Purity: ≥99.95%, or customized

Diameter: ≥0.018 mm, or customized

Custom sizes and standard sizes in stock
Quick Lead Time
Competitive Price

Silver Bonding Wire is a high-performance conductive material specially designed for the packaging and electrical connections of electronic components. It is made from high-quality silver and silver alloy through special techniques, offering extremely low electrical resistance and excellent oxidation resistance. As a leading supplier and manufacturer of premium silver products, Heeger Metal leverages advanced technology to deliver high-quality silver bonding wires for various applications.

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Or email us at max@heegermaterials.com.

Silver Bonding Wire Data Sheet

Reference Code:	HMSI2709
CAS:	7440-22-4
Purity:	≥99.95%, or customized
Density:	10.503 g/cm³
Melting Point:	961.78℃
Boiling Point:	2162℃
Diameter:	≥0.018 mm, or customized
Temper:	Annealed or Unannealed

Silver Bonding Wire Description

Silver Bonding Wire is made from high-purity silver (5N and above) and utilizes proprietary alloying casting and processing technologies. This effectively addresses issues such as rapid diffusion of silver-aluminum intermetallic compounds and performance degradation, while significantly enhancing corrosion resistance, making it an excellent alternative to gold wire. Silver bonding wire is widely used in integrated circuits and semiconductor devices, and slightly thicker wires can also be used to manufacture audio cables. As a metal bonding material, Heeger Metal provides bonding wires in gold (Au), silver (Ag), copper (Cu), and aluminum (Al), with fine wires (10-38μm) and thicker wires (100-500μm) for power devices. In addition to offering wire with smooth, clean surfaces and good dimensional stability, we also provide comprehensive solutions and expertise in metal bonding.

Silver Bonding Wire Composition and Characteristics

Type	YA1	YA2	YA3	YA4
Main content	Ag≥99.0% AuPd≤1.0%	Ag≥95.0% AuPd≤5.0%	Ag≥88.0% AuPd≤12.0%	Ag≥85.0% AuPd≤15.0%
Characteristics	Low electrical resistivity high thermal conductivity	Good corrosion resistance	good corrosion resistance	Good fatigue resistance

Silver Bonding Wire Specifications and Mechanical Properties

Diameter		B/L(gf)				E/L(%)
μm	mil	YA1	YA2	YA3	YA4	YA
15±1	0.6	>1.5	>2	>3	>4	2 – 10
16±1	0.65	>2	>3	>4	>5	2 – 10
18±1	0.7	>4	>5	>6	>7	5 – 15
20±1	0.8	>5	>6	>7	>8	5 – 15
23±1	0.9	>7	>8	>10	>11	5- 15
25±1	1.0	>9	>10	>12	>13	5- 15
30±1	1.2	>13	>14	>15	>16	8- 18
32±1	1.25	>15	>16	>17	>18	8 – 18
38±1	1.5	>20	>21	>22	>23	10 – 20
50±2	2.0	>34	>36	>38	>40	10 – 20
75±3	3.0	>68	>70	>75	>78	15 – 25

Silver Bonding Wire Fusing Current and Hardness

Type			YA1	YA2	YA3	YA4
	μm	mil	YA1	YA2	YA3	YA4
Fusing Current (A,10mm)	18	0.7	0.38	0.35	0.32	0.30
	20	0.8	0.49	0.45	0.42	0.39
	23	0.9	0.62	0.57	0.53	0.48
	25	1.0	0.76	0.70	0.64	0.61
	30	1.2	1.07	0.99	0.91	0.89
	38	1.5	1.66	1.54	1.42	1.37
	50	2.0	2.91	2.74	2.52	2.43
Hardness (Hv)	Wire		56-61	59-64	61-66	63-68
Hardness (Hv)	FAB		50-55	53-58	55-59	56-60

Silver Bonding Wire Features

Excellent conductivity
Excellent heat dissipation
Good reflectivity
Good solderability

Silver Bonding Wire Applications

Silver Bonding Wire plays a crucial role in connecting chips with circuits, packaging optoelectronic devices, and transmitting signals in sensors, ensuring efficient and stable electrical connections between electronic components. The application fields include semiconductor packaging, integrated circuit connections, optoelectronic device packaging, sensors, and automotive electronics. Here are the specific applications of every type:

YA1	YA2	YA3	YA4
Common	LED TR IC CARD QFN TSOP Flash Memo	LED QFP TSSOP QFN DFN IC CARD MQFP PBGA TQFP BGA Flash Memo	TQFP TSSOP PBGA BGA

Silver Bonding Wire Packaging

Silver Bonding Wire is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Silver Properties

Element	Value
Atomic number	47
Crystal structure	Face centred cubic
Electronic structure	Kr 4d¹⁰ 5s¹
Valences shown	1-2,2
Atomic weight( amu )	107.8682
Thermal neutron absorption cross-section( Barns )	63.8
Photo-electric work function( eV )	4.7
Natural isotope distribution( Mass No./% )	107/ 51.83
Natural isotope distribution( Mass No./% )	109/ 48.17
Atomic radius – Goldschmidt( nm )	0.144
Ionisation potential( No./eV )	2/ 21.5
Ionisation potential( No./eV )	1/ 7.58
Ionisation potential( No./eV )	3/ 34.8

Element	Value
Material condition	Hard
Material condition	Soft
Poisson’s ratio	0.367
Poisson’s ratio	0.367
Bulk modulus( GPa )	103.6
Bulk modulus( GPa )	103.6
Tensile modulus( GPa )	82.7
Tensile modulus( GPa )	82.7
Izod toughness( J m⁻¹ )	5
Hardness – Vickers( kgf mm⁻² )	95
Hardness – Vickers( kgf mm⁻² )	25
Tensile strength( MPa )	330
Tensile strength( MPa )	172

Element	Value
Electrical resistivity( µOhmcm )	1.63@20@20°C
Temperature coefficient( K⁻¹ )	0.0041@0-100°C
Thermal emf against Pt (cold 0C – hot 100C)( mV )	0.74

Element	Value
Boiling point( C )	2212
Density( gcm⁻³ )	10.5@20°C

Element	Value
Melting point( C )	961.9
Latent heat of evaporation( J g⁻¹ )	2390
Latent heat of fusion( J g⁻¹ )	103
Specific heat( J K⁻¹ kg⁻¹ )	237@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	429@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	19.1@0-100°C

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Company Profile

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To customize your silver bonding wire, please provide the following details:

Diameter (for the wire)
Length (indicate the length you need)
Form (straight, coiled, or spooled)
Purity of the material
Surface Finish (e.g., polished, rough, oxide-coated, etc.)
Quantity of the products you need
Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of silver products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific platinum materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Metal, we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

Silver bonding wire is a high-purity silver or silver-alloy wire used in semiconductor packaging and microelectronics for electrical connections between chips and substrates.

Silver bonding wire offers lower cost, higher electrical conductivity, and better thermal performance than gold wire, though it may require anti-oxidation coatings.

Anti-oxidation methods include palladium coating, alloying with Au/Pd, or storage in nitrogen-filled packaging.

Heeger Metal, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of silver products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Useful Information

Standard Wire Gauge Chart For AWG Conversion