Titanium Sputtering Target

Titanium Sputtering Target

Titanium Sputtering Target

Material: Gr.1, Gr.2, Gr.3, Gr.7, Gr.9, Gr.12, Gr.16, etc.

Purity: 99.95%-99.995%

  • Custom sizes and standard sizes in stock
  • Quick Lead Time
  • Competitive Price
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Titanium Sputtering Target is one of the most widely used target materials, made from high-purity titanium. It offers superior performance and reliability for various thin film deposition applications. As a leading supplier and manufacturer of premium titanium products, Heeger Materials leverages advanced technology to deliver high-purity titanium and titanium alloy sputtering targets for various applications.

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Or email us at sales@heegermaterials.com.

Titanium Sputtering Target Data Sheet

Reference:HMST319
Material:Gr.1, Gr.2, Gr.3, Gr.7, Gr.9, Gr.12, Gr.16, etc.
Purity:99.95%-99.995%
Average Grain Size:≤100 μm
Density:4.5 g/cm3
Melting Point:1660 ℃
Shape:Flat, Rotary, or Customized
Bonding:Unbonding or Bonding

Titanium Sputtering Target

Titanium (Ti), a silver transition metal with a low density of 4.54 g/cm3, exhibits lightweight, high strength, and corrosion resistance. Titanium Sputtering Target is made from high-purity titanium powder, ensuring excellent consistency and uniformity during sputtering processes. It is one of the barrier film materials commonly used in ultra-large-scale integrated circuit chips. HM can supply customized purity, size, and density solutions according to specific requirements.

  • Cylinder Titanium Sputtering Target
    Cylinder Titanium Sputtering Target
  • Rectangular Titanium Sputtering Target
    Rectangular Titanium Sputtering Target
  • Rotary Titanium Sputtering Target
    Rotary Titanium Sputtering Target

Titanium Sputtering Target Material Chemical Composition

TypeElement (%)
NCHFeOAlVMoNiPdTi
GR.1≤0.03≤0.08≤0.015≤0.2≤0.18     Residual
GR.2≤0.03≤0.08≤0.015≤0.3≤0.25     Residual
GR.3≤0.05≤0.08≤0.015≤0.3≤0.35     Residual
GR.7≤0.03≤0.08≤0.015≤0.3≤0.25    0.12-0.25Residual
GR.9≤0.02≤0.08≤0.015≤0.25≤0.152.5-3.32.0-3.0   Residual
GR.12≤0.03≤0.08≤0.015≤0.3≤0.25  0.2-0.40.6-0.9 Residual
GR.16≤0.03≤0.08≤0.015≤0.3≤0.25    0.04-0.08

Titanium Sputtering Target Specifications

Material TypeTitaniumCoefficient of Thermal Expansion8.6 x 10-6/K
SymbolTiTheoretical Density (g/cc)4.5
Atomic Weight47.867Z Ratio0.628
Atomic Number22SputterDC
Color/AppearanceSilvery MetallicMax Power Density (Watts/Square Inch)50*
Thermal Conductivity21.9 W/m.KType of BondIndium, Elastomer
Melting Point (°C)1,660CommentsAlloys with W/Ta/Mo; evolve gas on first heating.

Titanium Sputtering Target Stock Dimensions

Circular Sputtering TargetsDiameter1.0”
2.0”
3.0”
4.0”
5.0”
6.0”
up to 21”
Rectangular Sputtering TargetsWidth x Length5” x 12”
5” x 15”
5” x 20”
5” x 22”
6” x 20”
Thickness0.125”, 0.25”

Titanium Sputtering Target Microstructure Image

The microstructure image of 100 μm grain size
The Microstructure Image_100 μm Grain Size

Titanium Sputtering Target Advantages

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Titanium Sputtering Target Production Process

Generally prepared using the powder metallurgy method, the purity of titanium powder should be above 99.95%. The specific process is as follows:

  • Put the titanium powder in the vacuum heat treatment furnace for pre-gassing, then introduce hydrogen and continue heating for degassing.
  • The degassed titanium powder is sintered once by vacuum hot pressing.
  • The primary sintered product is passed through a hot isostatic press to complete the secondary sintering.
  • After the secondary sintering, the whole surface of the product is ground by machining to get the final product.

Titanium Sputtering Target Applications

  • Titanium sputtering target can be used as the barrier film material for ultra-large-scale integrated circuit chips.
  • Titanium sputtering target is ideal for depositing thin film for flat panel displays.
  • Titanium sputtering target is commonly used in Physical Vapor Deposition (PVD) and Magnetron Sputtering techniques to produce optical thin films, anti-reflective films, etc.
  • Titanium sputtering target helps make components exceptionally light, thin, small, and densely packed, when sputtered to create interconnections in LSI, VLSI, and ULSI.

Titanium Sputtering Target Packaging

The Titanium Sputtering Target is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Metal Packing

Titanium Properties

ItemValue
Atomic number22
Crystal structureHexagonal close packed
Electronic structureAr 3d² 4s²
Valences shown2,3,4
Atomic weight( amu )47.88
Thermal neutron absorption cross-section( Barns )6.1
Photo-electric work function( eV )4.1
Natural isotope distribution( Mass No./% )50/ 5.3
Natural isotope distribution( Mass No./% )49/ 5.5
Natural isotope distribution( Mass No./% )46/ 8.0
Natural isotope distribution( Mass No./% )48/ 73.7
Natural isotope distribution( Mass No./% )47/ 7.5
Atomic radius – Goldschmidt( nm )0.147
Ionisation potential( No./eV )3/ 27.5
Ionisation potential( No./eV )4/ 43.3
Ionisation potential( No./eV )5/ 99.2
Ionisation potential( No./eV )1/ 6.82
Ionisation potential( No./eV )2/ 13.6
Ionisation potential( No./eV )6/ 119
ItemValue
Material conditionPolycrystalline
Material conditionAnnealed
Poisson’s ratio0.361
Poisson’s ratio0.361
Poisson’s ratio–
Bulk modulus( GPa )108.4
Bulk modulus( GPa )–
Bulk modulus( GPa )108.4
Tensile modulus( GPa )–
Tensile modulus( GPa )120.2
Tensile modulus( GPa )120.2
Izod toughness( J m⁻¹ )61
Izod toughness( J m⁻¹ )61
Hardness – Vickers( kgf mm⁻² )60
Hardness – Vickers( kgf mm⁻² )60
Tensile strength( MPa )230-460
Tensile strength( MPa )230-460
Yield strength( MPa )140-250
Yield strength( MPa )140-250
ItemValue
Electrical resistivity( µOhmcm )54@20@20°C
Superconductivity critical temperature( K )0.4
Temperature coefficient( K⁻¹ )0.0038@0-100°C
ItemValue
Boiling point( °C )3287
Density( gcm⁻³ )4.5@20°C
ItemValue
Melting point( °C )1660
Latent heat of evaporation( J g⁻¹ )8893
Latent heat of fusion( J g⁻¹ )365
Specific heat( J K⁻¹ kg⁻¹ )523@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )21.9@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )8.9@0-100°C

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To customize your titanium sputtering target, please provide the following details:

  1. Diameter (for the circular sputtering targets)
  2. Width × Length (for the rectangular sputtering targets)
  3. Thcikness (for the sputtering targets)
  4. Purity of the material
  5. Backing Plate (If bonding service is required, please specify the material and dimensions of the backing plate.）
  6. Quantity of the products you need
  7. Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of titanium and titanium alloy products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific titanium materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Materials Inc., we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

Heeger Materials Inc., established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of tantalum and tantalum alloys. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Sputtering Targets Products

Heeger Metal offers a wide selection of high-performance sputtering targets made from materials like titanium, copper, aluminum, and rare earth metals. Our custom sputtering targets are precision-engineered to meet the demands of industries such as semiconductor manufacturing, photovoltaics, and electronics. With superior purity and consistency, our sputtering targets deliver exceptional film deposition performance, making them ideal for thin-film coating, sputtering, and PVD (Physical Vapor Deposition) applications.

Other Titanium Products

Heeger Metal offers a comprehensive range of titanium and titanium alloy products, including powders and finished parts, with customization options available. Renowned for their exceptional strength, corrosion resistance, and high-temperature stability, these materials are perfect for aerospace, electronics, and chemical processing applications.

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