Platinum Sputtering Target

Platinum Sputtering Target Chemical Composition

Product		Platinum Sputtering Target
Pt (%)		99.99	99.95
Impurities≤(%)	Pd	0.003	0.01
	Rh	0.003	0.02
	Ir	0.003	0.02
	Ru	0.003	0.02
	Au	0.003	0.01
	Ag	0.001	0.005
	Cu	0.001	0.005
	Fe	0.001	0.005
	Ni	0.001	0.005
	Al	0.003	0.005
	Pb	0.002	0.005
	Mn	0.002	0.005
	Cr	0.002	0.005
	Mg	0.002	0.005
	Sn	0.002	0.005
	Si	0.003	0.005
	Zn	0.002	0.005
	Bi	0.002	0.005
Total impurities ≤(%)		0.01	0.05

Platinum Sputtering Target Specifications

Symbol	Pt
CAS	7440-06-4
Purity	99.99%
Atomic Weight	195.084
Atomic Number	78
Color/Appearance	Metallic Grey
Thermal Conductivity	72 W/m·K
Melting Point (℃)	1772
Coefficient of Thermal Expansion	8.8×10-6/K
Theoretical Density (g/cc)	21.45
Z Ratio	0.245
Sputter	DC
Max Power Density (Watts/Square Inch)	100*
Type of Bond	Indium, Elastomer

Platinum Sputtering Target Stock Dimensions

Circular Sputtering Targets	Diameter	1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″
Rectangular Sputtering Targets	Width x Length	5″ x 12″ 5””x 15″ 5″ x 20″ 5″ x 22″ 6″ x 20″
Thickness		0.125″, 0.25″

Platinum Sputtering Target Manufacturing Processes

• Material Preparation: Select high-purity platinum raw material (typically ≥99.95% purity)
• Vacuum Induction Melting: A high-precision melting process using vacuum induction to ensure uniform alloy composition and eliminate contaminants.
• Annealing: A heat treatment process to relieve internal stresses, improve material properties, and achieve desired hardness and ductility.
• Rolling: The material is passed through rollers to reduce thickness, increase length, and refine the structure for further processing.
• Stamping: Using mechanical presses to shape or cut the material into specific forms, ensuring precise dimensions and consistency.
• Metallographic Testing: Detailed analysis of the material’s microstructure to ensure the quality and integrity of the alloy before further processing.
• Machining: Precision machining processes (such as turning, milling, or grinding) to achieve the desired shapes and tolerances.
• Dimensional inspection: Measuring and verifying the dimensions of the product to ensure they meet the required specifications.
• Cleaning: Thorough cleaning of the material to remove any residue, oils, or contaminants left from the manufacturing processes.
• Final Inspection: A comprehensive inspection process to ensure the product meets all quality and functional standards.

Platinum Sputtering Target Applications

• Semiconductor Industry: Used in sputtering to create high-performance thin films, such as electrodes, conductive layers, or barrier layers.
• Optical Coatings: Employed to produce highly reflective or corrosion-resistant optical films, such as mirrors or laser components.
• Medical Devices: Utilized for biocompatible coatings on implantable medical devices.
• Electronics Industry: Applied in producing sensors, resistors, or high-precision conductive films in integrated circuits.
• Scientific Research: Used in materials science to prepare specialized platinum-based thin films.
• Energy Sector: Employed in making electrode coatings for fuel cells or solar cells.

Platinum Sputtering Target Packaging

Platinum Sputtering Target is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.