Palladium Sputtering Target

Palladium Sputtering Target

Palladium Sputtering Target

Purity: ≥99.95%, or customized

Shape: Disc, Rectangular, Tube, or customized

  • Custom sizes and standard sizes in stock
  • Quick Lead Time
  • Competitive Price
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Palladium Sputtering Target is made from high-purity palladium metal, widely applied in thin film deposition technologies. As a leading supplier and manufacturer of premium palladium products, Heeger Metal leverages advanced technology to deliver high-quality palladium sputtering targets for various applications.

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Or email us at max@heegermaterials.com.

Palladium Sputtering Target Data Sheet

Reference Code:HTST17
CAS:7440-05-3
Purity:≥99.95%, or customized
Density:12.023 g/cm3
Melting Point:1554℃
Boiling Point:2970℃
Shape:Disc, Rectangular, Tube, or customized
Bonding:Bongding or Unbonding

Palladium Sputtering Target Description

Palladium (Pd) has the unique ability to absorb and release hydrogen, making it an ideal choice for hydrogenation and purification systems. Palladium Sputtering Target is made of high-purity palladium metal. It is widely used in film deposition technologies, particularly in fields such as semiconductors, optical coatings, flat-panel displays, and solar cells. In the magnetron sputtering process, the palladium sputtering target is used to deposit a uniform thin film onto the substrate. Heeger Metal can supply high-precision palladium sputtering targets in various specifications to suit industrial and research applications, ensuring optimal performance and cost-effectiveness.

  • Palladium Sputtering Target
  • Palladium Sputtering Target
  • Palladium Sputtering Target

Palladium Sputtering Target Specifications

Material TypePalladium
SymbolPd
Atomic Weight106.42
Atomic Number46
Color/AppearanceSilvery White Metallic
Thermal Conductivity72 W/m.K
Melting Point (°C)1,554
Coefficient of Thermal Expansion11.8 x 10-6/K
Theoretical Density (g/cc)12.02
Z Ratio0.357
SputterDC
Max Power Density
(Watts/Square Inch)		100*
Type of BondIndium, Elastomer
CommentsAlloys with refractory metals.

Palladium Sputtering Target Stock Dimensions

Circular Sputtering TargetsDiameter1.0″
2.0″
3.0″
4.0″
5.0″
6.0″
up to 21″
Rectangular Sputtering TargetsWidth x Length5″ x 12″
5””x 15″
5″ x 20″
5″ x 22″
6″ x 20″
Thickness0.125″, 0.25″

Palladium Sputtering Target Manufacturing Processes

  • Material Preparation: Select high-purity palladium raw material (typically ≥99.95% purity)
  • Vacuum Induction Melting: A high-precision melting process using vacuum induction to ensure uniform alloy composition and eliminate contaminants.
  • Annealing: A heat treatment process to relieve internal stresses, improve material properties, and achieve desired hardness and ductility.
  • Rolling: The material is passed through rollers to reduce thickness, increase length, and refine the structure for further processing.
  • Stamping: Using mechanical presses to shape or cut the material into specific forms, ensuring precise dimensions and consistency.
  • Metallographic Testing: Detailed analysis of the material’s microstructure to ensure the quality and integrity of the alloy before further processing.
  • Machining: Precision machining processes (such as turning, milling, or grinding) to achieve the desired shapes and tolerances.
  • Dimensional inspection: Measuring and verifying the dimensions of the product to ensure they meet the required specifications.
  • Cleaning: Thorough cleaning of the material to remove any residue, oils, or contaminants left from the manufacturing processes.
  • Final Inspection: A comprehensive inspection process to ensure the product meets all quality and functional standards.

Palladium Sputtering Target Applications

  • Electronics Industry: Palladium sputtering targets are widely used in thin film deposition, particularly in semiconductor manufacturing, for creating electrode layers in integrated circuits, capacitors, and sensors.
  • Optical Coatings: Palladium sputtering targets are used to produce high-reflection optical thin films, which are commonly applied in laser systems, optical lenses, and displays.
  • Solar Cells: Palladium sputtering targets are used as electrode materials in solar cells, helping to improve their efficiency.
  • Flat-Panel Displays: Palladium sputtering targets are used in the production of conductive thin films in flat-panel displays, ensuring the performance and stability of the displays.
  • Magnetic Materials: Palladium sputtering targets are used in the deposition of thin films for magnetic materials, which are applied in hard disk drives and magnetic recording devices.
  • Chemical Industry: Palladium sputtering targets are used as catalysts in organic synthesis reactions, particularly in hydrogenation and dehydrogenation processes.

Palladium Sputtering Target Packaging

Palladium Sputtering Target is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Metal Packing

Palladium Properties

ElementValue
Atomic number46
Crystal structureFace centred cubic
Electronic structureKr 4d¹⁰
Valences shown2, 3, 4
Atomic weight( amu )106.42
Thermal neutron absorption cross-section( Barns )6
Photo-electric work function( eV )5
Natural isotope distribution( Mass No./% )108/ 26.7
Natural isotope distribution( Mass No./% )110/ 11.8
Natural isotope distribution( Mass No./% )104/ 11.0
Natural isotope distribution( Mass No./% )102/ 1.0
Natural isotope distribution( Mass No./% )105/ 22.2
Natural isotope distribution( Mass No./% )106/ 27.3
Atomic radius – Goldschmidt( nm )0.137
Ionisation potential( No./eV )1/ 8.3
Ionisation potential( No./eV )2/ 19.4
Ionisation potential( No./eV )3/ 32.9
ElementValue
Material conditionSoft
Material conditionHard
Poisson’s ratio0.39
Poisson’s ratio0.39
Bulk modulus( GPa )187
Bulk modulus( GPa )187
Tensile modulus( GPa )121
Tensile modulus( GPa )121
Hardness – Vickers( kgf mm⁻² )40
Hardness – Vickers( kgf mm⁻² )100
Tensile strength( MPa )140-195
Tensile strength( MPa )325
Yield strength( MPa )205
Yield strength( MPa )34.5
ElementValue
Electrical resistivity( µOhmcm )10.8@20@20
Temperature coefficient( K⁻¹ )0.0042@0-100
Thermal emf against Pt (cold 0C – hot 100C)( mV )-0.57
ElementValue
Boiling point( C )3140
Density( gcm⁻³ )12@20°C
ElementValue
Melting point( C )1554
Latent heat of evaporation( J g⁻¹ )3398
Latent heat of fusion( J g⁻¹ )157
Specific heat( J K⁻¹ kg⁻¹ )244@25
Thermal conductivity( W m⁻¹ K⁻¹ )71.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )11@0-100

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To customize your palladium sputtering target, please provide the following details:

  1. Diameter (for the circular sputtering targets)
  2. Width × Length (for the rectangular sputtering targets)
  3. Thickness (for the sputtering targets)
  4. Backing Plate (If bonding service is required, please specify the material and dimensions of the backing plate.）
  5. Purity (Specify the purity of material.)
  6. Quantity of the products you need
  7. Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of palladium products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific platinum materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Metal, we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

Standard purities: 99.95%, and 99.99%, with 99.999% (5N) customized on required.

  • Circular (1-12″ diameter)
  • Rectangular (up to 300 mm length)
  • Customized geometries

≥99.95% theoretical density (12.02 g/cm3) via HIP processing.

Heeger Metal, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of palladium products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Sputtering Targets Products

Heeger Metal offers a wide selection of high-performance sputtering targets made from materials like titanium, copper, aluminum, and rare earth metals. Our custom sputtering targets are precision-engineered to meet the demands of industries such as semiconductor manufacturing, photovoltaics, and electronics. With superior purity and consistency, our sputtering targets deliver exceptional film deposition performance, making them ideal for thin-film coating, sputtering, and PVD (Physical Vapor Deposition) applications.

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