Cátodos para sputtering de paladio
Cátodos para sputtering de paladio
Pureza: ≥99,95%, o personalizada
Shape: Disc, Rectangular, Tube, or customized
Palladium Sputtering Target is made from high-purity palladium metal, widely applied in thin film deposition technologies. As a leading supplier and manufacturer of premium palladium products, Heeger Metal leverages advanced technology to deliver high-quality palladium sputtering targets for various applications.
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Palladium Sputtering Target Data Sheet
| Código de referencia: | HTST17 |
|---|---|
| CAS: | 7440-05-3 |
| Pureza: | ≥99.95%, o personalizado |
| Densidad: | 12,023 g/cm3 |
| Punto de fusión: | 1554℃ |
| Punto de ebullición: | 2970℃ |
| Forma: | Disc, Rectangular, Tube, or customized |
| Vinculación: | Bongding or Unbonding |
Palladium Sputtering Target Description
Palladium (Pd) has the unique ability to absorb and release hydrogen, making it an ideal choice for hydrogenation and purification systems. Palladium Sputtering Target is made of high-purity palladium metal. It is widely used in film deposition technologies, particularly in fields such as semiconductors, optical coatings, flat-panel displays, and solar cells. In the magnetron sputtering process, the palladium sputtering target is used to deposit a uniform thin film onto the substrate. Heeger Metal can supply high-precision palladium sputtering targets in various specifications to suit industrial and research applications, ensuring optimal performance and cost-effectiveness.
Palladium Sputtering Target Specifications
| Tipo de material | Paladio |
|---|---|
| Símbolo | Pd |
| Peso atómico | 106.42 |
| Número atómico | 46 |
| Color/Apariencia | Silvery White Metallic |
| Conductividad térmica | 72 W/m.K |
| Punto de fusión (°C) | 1,554 |
| Coeficiente de dilatación térmica | 11.8 x 10-6/K |
| Densidad teórica (g/cc) | 12.02 |
| Ratio Z | 0.357 |
| Pulverización catódica | DC |
| Max Power Density (Watts/Square Inch) | 100* |
| Tipo de bono | Indio, elastómero |
| Comentarios | Alloys with refractory metals. |
Palladium Sputtering Target Stock Dimensions
| Cátodos para sputtering circular | Diámetro | 1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″ |
|---|---|---|
| Cátodos rectangulares para sputtering | Anchura x Longitud | 5″ x 12″ 5””x 15″ 5″ x 20″ 5″ x 22″ 6″ x 20″ |
| Espesor | 0.125″, 0.25″ | |
Palladium Sputtering Target Manufacturing Processes
- Preparación del material: Select high-purity palladium raw material (typically ≥99.95% purity)
- Vacuum Induction Melting: A high-precision melting process using vacuum induction to ensure uniform alloy composition and eliminate contaminants.
- Recocido: A heat treatment process to relieve internal stresses, improve material properties, and achieve desired hardness and ductility.
- Rodando: The material is passed through rollers to reduce thickness, increase length, and refine the structure for further processing.
- Stamping: Using mechanical presses to shape or cut the material into specific forms, ensuring precise dimensions and consistency.
- Metallographic Testing: Detailed analysis of the material’s microstructure to ensure the quality and integrity of the alloy before further processing.
- Mecanizado: Precision machining processes (such as turning, milling, or grinding) to achieve the desired shapes and tolerances.
- Dimensional inspection: Measuring and verifying the dimensions of the product to ensure they meet the required specifications.
- Cleaning: Thorough cleaning of the material to remove any residue, oils, or contaminants left from the manufacturing processes.
- Final Inspection: A comprehensive inspection process to ensure the product meets all quality and functional standards.
Palladium Sputtering Target Applications
- Industria electrónica: Palladium sputtering targets are widely used in thin film deposition, particularly in semiconductor manufacturing, for creating electrode layers in integrated circuits, capacitors, and sensors.
- Optical Coatings: Palladium sputtering targets are used to produce high-reflection optical thin films, which are commonly applied in laser systems, optical lenses, and displays.
- Células solares: Palladium sputtering targets are used as electrode materials in solar cells, helping to improve their efficiency.
- Flat-Panel Displays: Palladium sputtering targets are used in the production of conductive thin films in flat-panel displays, ensuring the performance and stability of the displays.
- Magnetic Materials: Palladium sputtering targets are used in the deposition of thin films for magnetic materials, which are applied in hard disk drives and magnetic recording devices.
- Industria química: Palladium sputtering targets are used as catalysts in organic synthesis reactions, particularly in hydrogenation and dehydrogenation processes.
Palladium Sputtering Target Packaging
Palladium Sputtering Target is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
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Cátodos para sputtering Productos
Heeger Metal ofrece una amplia selección de cátodos para sputtering de alto rendimiento fabricados con materiales como titanio, cobre, aluminio y metales de tierras raras. Nuestros cátodos para sputtering personalizados están diseñados con precisión para satisfacer las demandas de industrias como la fabricación de semiconductores, la fotovoltaica y la electrónica. Con una pureza y consistencia superiores, nuestros cátodos para sputtering ofrecen un rendimiento excepcional en la deposición de películas, lo que los hace ideales para aplicaciones de recubrimiento de películas finas, sputtering y PVD (deposición física de vapor).