Palladium Sputtering Target
Palladium Sputtering Target
Reinheit: ≥99.95%, oder kundenspezifisch
Shape: Disc, Rectangular, Tube, or customized
Palladium Sputtering Target is made from high-purity palladium metal, widely applied in thin film deposition technologies. As a leading supplier and manufacturer of premium palladium products, Heeger Metal leverages advanced technology to deliver high-quality palladium sputtering targets for various applications.
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Palladium Sputtering Target Data Sheet
| Referenz-Code: | HTST17 |
|---|---|
| CAS: | 7440-05-3 |
| Reinheit: | ≥99.95%, oder kundenspezifisch |
| Die Dichte: | 12.023 g/cm3 |
| Schmelzpunkt: | 1554℃ |
| Siedepunkt: | 2970℃ |
| Die Form: | Disc, Rectangular, Tube, or customized |
| Bindung: | Bongding or Unbonding |
Palladium Sputtering Target Description
Palladium (Pd) has the unique ability to absorb and release hydrogen, making it an ideal choice for hydrogenation and purification systems. Palladium Sputtering Target is made of high-purity palladium metal. It is widely used in film deposition technologies, particularly in fields such as semiconductors, optical coatings, flat-panel displays, and solar cells. In the magnetron sputtering process, the palladium sputtering target is used to deposit a uniform thin film onto the substrate. Heeger Metal can supply high-precision palladium sputtering targets in various specifications to suit industrial and research applications, ensuring optimal performance and cost-effectiveness.
Palladium Sputtering Target Specifications
| Material Typ | Palladium |
|---|---|
| Symbol | Pd |
| Atomares Gewicht | 106.42 |
| Ordnungszahl | 46 |
| Farbe/Erscheinungsbild | Silvery White Metallic |
| Wärmeleitfähigkeit | 72 W/m.K |
| Schmelzpunkt (°C) | 1,554 |
| Wärmeausdehnungskoeffizient | 11.8 x 10-6/K |
| Theoretische Dichte (g/cc) | 12.02 |
| Z-Verhältnis | 0.357 |
| Sputter | DC |
| Max Power Density (Watts/Square Inch) | 100* |
| Art der Anleihe | Indium, Elastomer |
| Kommentare | Alloys with refractory metals. |
Palladium Sputtering Target Stock Dimensions
| Zirkulare Sputtering-Targets | Durchmesser | 1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″ |
|---|---|---|
| Rechteckige Sputtering-Targets | Breite x Länge | 5″ x 12″ 5””x 15″ 5″ x 20″ 5″ x 22″ 6″ x 20″ |
| Dicke | 0.125″, 0.25″ | |
Palladium Sputtering Target Manufacturing Processes
- Material Preparation: Select high-purity palladium raw material (typically ≥99.95% purity)
- Vacuum Induction Melting: A high-precision melting process using vacuum induction to ensure uniform alloy composition and eliminate contaminants.
- Glühen: A heat treatment process to relieve internal stresses, improve material properties, and achieve desired hardness and ductility.
- Rollender: The material is passed through rollers to reduce thickness, increase length, and refine the structure for further processing.
- Stamping: Using mechanical presses to shape or cut the material into specific forms, ensuring precise dimensions and consistency.
- Metallographic Testing: Detailed analysis of the material’s microstructure to ensure the quality and integrity of the alloy before further processing.
- Bearbeitung: Precision machining processes (such as turning, milling, or grinding) to achieve the desired shapes and tolerances.
- Dimensional inspection: Measuring and verifying the dimensions of the product to ensure they meet the required specifications.
- Cleaning: Thorough cleaning of the material to remove any residue, oils, or contaminants left from the manufacturing processes.
- Final Inspection: A comprehensive inspection process to ensure the product meets all quality and functional standards.
Palladium Sputtering Target Applications
- Elektronikindustrie: Palladium sputtering targets are widely used in thin film deposition, particularly in semiconductor manufacturing, for creating electrode layers in integrated circuits, capacitors, and sensors.
- Optical Coatings: Palladium sputtering targets are used to produce high-reflection optical thin films, which are commonly applied in laser systems, optical lenses, and displays.
- Solar Cells: Palladium sputtering targets are used as electrode materials in solar cells, helping to improve their efficiency.
- Flat-Panel Displays: Palladium sputtering targets are used in the production of conductive thin films in flat-panel displays, ensuring the performance and stability of the displays.
- Magnetic Materials: Palladium sputtering targets are used in the deposition of thin films for magnetic materials, which are applied in hard disk drives and magnetic recording devices.
- Chemische Industrie: Palladium sputtering targets are used as catalysts in organic synthesis reactions, particularly in hydrogenation and dehydrogenation processes.
Palladium Sputtering Target Packaging
Palladium Sputtering Target is carefully placed in wooden cases or cartons with additional soft materials to support and prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
Palladium Properties
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Sputtering Targets Produkte
Heeger Metal bietet eine große Auswahl an Hochleistungs-Sputtertargets aus Materialien wie Titan, Kupfer, Aluminium und Seltenerdmetallen. Unsere kundenspezifischen Sputtertargets sind präzisionsgefertigt, um den Anforderungen von Branchen wie der Halbleiterherstellung, Photovoltaik und Elektronik gerecht zu werden. Dank ihrer überragenden Reinheit und Konsistenz bieten unsere Sputtertargets eine außergewöhnliche Leistung bei der Schichtabscheidung und sind damit ideal für die Dünnfilmbeschichtung, das Sputtern und PVD-Anwendungen (Physical Vapor Deposition).