Tantal Sputtering Target
Tantal Sputtering Target
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Material: R05200, R05400
Tantalum Sputtering Target is made from high-purity tantalum material through pressure processing, offering high chemical purity, fine grain size, good recrystallized structure, and excellent consistency along all three axes. As a leading supplier and manufacturer of premium tantalum products, Heeger Materials leverages advanced machining centers to deliver high-precision tantalum sputtering target for a wide range of applications.
Oder senden Sie uns eine E-Mail an max@heegermaterials.com.
Tantalum Sputtering Target Data Sheet
| Referenz: | HMST22 |
|---|---|
| Abmessungen: | Dicke: 0.125″-0.25″ Zirkulare Sputtering-Targets: 1.0″-21″ (diameter), or customized Rechteckige Sputtering-Targets: 5″×12″, 5″×15″, 5″×20″, 5″×22″, 6″×20″, or customized |
| Material: | R05200, R05400 |
| Reinheit: | 99.9%, 99.95%, 99.99%, 99.999% |
| Forms: | Flat Target, Rotary Target, or Custom Shapes |
| Bindung: | Bonding or Unbonding |
Tantalum (Ta) Specifications
| Material Typ | Tantal | Wärmeausdehnungskoeffizient | 6.3 x 10-6/K |
|---|---|---|---|
| Symbol | Ta | Theoretische Dichte (g/cc) | 16.6 |
| Atomares Gewicht | 180.94788 | Z-Verhältnis | 0.262 |
| Ordnungszahl | 73 | Sputter | DC |
| Farbe/Erscheinungsbild | Gray Blue, Metallic | Maximale Leistungsdichte (Watt/Quadratzoll) | 50* |
| Wärmeleitfähigkeit | 57 W/m.K | Art der Anleihe | Indium, Elastomer |
| Schmelzpunkt (°C) | 3,017 | Kommentare | Forms good films. |
Tantalum is classified as a transition metal on the Periodic Table and is considered one of the refractory metals highly resistant to corrosion. Due to its excellent corrosion resistance and thermal stability, tantalum is widely used in electronics, aerospace, and chemical engineering, particularly in manufacturing electronic components, chemical reactors, and semiconductors.
Tantalum Sputtering Target Stock Dimensions
| Zirkulare Sputtering-Targets | Durchmesser | 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” bis zu 21” |
|---|---|---|
| Rechteckige Sputtering-Targets | Breite x Länge | 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” |
| Dicke | 0.125”, 0.25” | |
Tantalum sputtering targets are manufactured to precise tolerances to meet specific application requirements. HM also offers bonding services, with the ability to customize dimensions and shapes based on customer specifications. The regular dimensions are as follows:
Tantalum Sputtering Target Material Chemical Composition
| Element | R05200 (%,Max) | R05400 (%,Max) |
|---|---|---|
| C | 0.01 | 0.01 |
| O | 0.015 | 0.03 |
| N | 0.01 | 0.01 |
| H | 0.0015 | 0.0015 |
| Fe | 0.01 | 0.01 |
| Mo | 0.02 | 0.02 |
| Nb | 0.1 | 0.1 |
| Ni | 0.01 | 0.01 |
| Si | 0.005 | 0.005 |
| Ti | 0.01 | 0.01 |
| W | 0.05 | 0.05 |
Tantalum Sputtering Target Manufacturing Process
The manufacturing process involves sintering high-purity tantalum powder into blocks and melting them into ingots via a high-vacuum electron beam. These ingots undergo repeated plastic deformation and annealing to produce target blanks with uniform grain structure, which are then welded to backplates and machined into the final product for semiconductor sputtering. Here is the typical production process:
- Sintern
- Vacuum Electron Beam Melting
- Plastic Deformation
- Glühen
- Metallographic Inspection
- Bearbeitung
- Dimensional Inspection
- Cleaning
- Final Inspection
Tantalum Sputtering Target Applications
The tantalum sputtering target, often called a bare target, is first soldered to a copper backing plate. It is then used in semiconductor or optical sputtering processes, where tantalum atoms are deposited as oxides onto a substrate to form a sputter coating. The main applications include:
Electronics and Semiconductors: Tantalum targets are widely used as barrier layers in integrated circuit (IC) manufacturing, particularly in copper interconnect technology. Tantalum’s high melting point and low resistance make it an ideal choice for these applications.
Anti-Corrosion Coatings: Due to its exceptional corrosion resistance, tantalum is frequently used to coat chemical equipment and metal surfaces exposed to harsh environments, helping to extend the service life of these materials.
Thin Films for Optics and Photonics: Tantalum targets are employed to create thin films with specific optical properties for use in various optical devices, displays, and sensors.
Medizinische Geräte: With its excellent biocompatibility, tantalum is used to coat medical implants such as bone plates and joint prostheses, reducing the risk of rejection by the body.
-
Electronics and Semiconductors: Tantalum targets are widely used as barrier layers in integrated circuit (IC) manufacturing, particularly in copper interconnect technology. Tantalum’s high melting point and low resistance make it an ideal choice for these applications.
-
Anti-Corrosion Coatings: Due to its exceptional corrosion resistance, tantalum is frequently used to coat chemical equipment and metal surfaces exposed to harsh environments, helping to extend the service life of these materials.
-
Thin Films for Optics and Photonics: Tantalum targets are employed to create thin films with specific optical properties for use in various optical devices, displays, and sensors.
-
Medizinische Geräte: With its excellent biocompatibility, tantalum is used to coat medical implants such as bone plates and joint prostheses, reducing the risk of rejection by the body.
Tantal und Tantal-Legierungen
- R05200, unlegiertes Tantal, Elektronenstrahl-Ofen-Vakuum-Lichtbogen-Schmelze, oder beides
- R05400, unlegiertes Tantal, pulvermetallurgische Verfestigung.
- R05255, Tantal-Legierung, 90 % Tantal, 10 % Wolfram, Elektronenstrahl-Ofen oder Vakuum-Lichtbogen-Schmelze, oder beides.
- R05252, tantalum alloy, 97.5 % tantalum, 2.5 % tungsten, electron-beam furnace or vacuum-arc melt, or both.
- R05240, Tantal-Legierung, 60 % Tantal, 40 % Niob, Elektronenstrahlofen oder Vakuum-Lichtbogenschmelze.
Tantalum Sputtering Target Packaging
The Tantalum Sputtering Target is carefully placed in wooden cases or cartons, with additional support from soft materials, to prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
Tantal-Eigenschaften
Herunterladen
Angebot einholen
Wir werden das prüfen und uns innerhalb von 24 Stunden bei Ihnen melden.
Andere Tantalprodukte
Heeger Metal bietet ein umfassendes Sortiment an Tantal und Tantallegierungen, die für ihre hervorragende Korrosionsbeständigkeit, ihren hohen Schmelzpunkt und ihre Stabilität in rauen Umgebungen bekannt sind. Diese Eigenschaften machen sie ideal für anspruchsvolle Anwendungen in der Luft- und Raumfahrt, in der Elektronik und in der chemischen Verarbeitungsindustrie. Unsere hochreinen Tantalwerkstoffe bieten außergewöhnliche Leistung und Zuverlässigkeit unter schwierigen Bedingungen.
Sputtering Targets Produkte
Heeger Metal bietet eine große Auswahl an Hochleistungs-Sputtertargets aus Materialien wie Titan, Kupfer, Aluminium und Seltenerdmetallen. Unsere kundenspezifischen Sputtertargets sind präzisionsgefertigt, um den Anforderungen von Branchen wie der Halbleiterherstellung, Photovoltaik und Elektronik gerecht zu werden. Dank ihrer überragenden Reinheit und Konsistenz bieten unsere Sputtertargets eine außergewöhnliche Leistung bei der Schichtabscheidung und sind damit ideal für die Dünnfilmbeschichtung, das Sputtern und PVD-Anwendungen (Physical Vapor Deposition).
Disc Products
Heeger Metal offers a wide range of metal and alloy disc products. Our precision-engineered discs are ideal for applications in aerospace, electronics, and industrial sectors, providing excellent strength, durability, and thermal conductivity. Whether you need custom metal discs or standard metal alloy discs, our products ensure high performance and exceptional quality.