Tantalum Sputtering Target

Purity: 99.9%, 99.95%, 99.99%, 99.999%

Material: R05200, R05400

Custom sizes and standard sizes in stock
Quick Lead Time
Competitive Price

Tantalum Sputtering Target is made from high-purity tantalum material through pressure processing, offering high chemical purity, fine grain size, good recrystallized structure, and excellent consistency along all three axes. As a leading supplier and manufacturer of premium tantalum products, Heeger Materials leverages advanced machining centers to deliver high-precision tantalum sputtering target for wide ranges of applications.

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Or email us at sales@heegermaterials.com.

Tantalum Sputtering Target Data Sheet

Reference:	HMST22
Dimensions:	Thickness: 0.125″-0.25″ Circular Sputtering Targets: 1.0″-21″ (diameter), or customized Rectangular Sputtering Targets: 5″×12″, 5″×15″, 5″×20″, 5″×22″, 6″×20″, or customized
Material:	R05200, R05400
Purity:	99.9%, 99.95%, 99.99%, 99.999%
Forms:	Flat Target, Rotary Target, or Custom Shapes
Bonding:	Bonding or Unbonding

Tantalum (Ta) Specifications

Tantalum is classified as a transition metal on the Periodic Table and is considered one of the refractory metals highly resistant to corrosion. Due to its excellent corrosion resistance and thermal stability, tantalum is widely used in electronics, aerospace, and chemical engineering, particularly in manufacturing electronic components, chemical reactors, and semiconductors.

Material Type	Tantalum	Coefficient of Thermal Expansion	6.3 x 10-6/K
Symbol	Ta	Theoretical Density (g/cc)	16.6
Atomic Weight	180.94788	Z Ratio	0.262
Atomic Number	73	Sputter	DC
Color/Appearance	Gray Blue, Metallic	Max Power Density (Watts/Square Inch)	50*
Thermal Conductivity	57 W/m.K	Type of Bond	Indium, Elastomer
Melting Point (°C)	3,017	Comments	Forms good films.

Tantalum Sputtering Target Stock Dimensions

Tantalum sputtering targets are manufactured to precise tolerances to meet specific application requirements. HM also offers bonding services, with the ability to customize dimensions and shapes based on customer specifications. The regular dimensions are as follows:

Circular Sputtering Targets	Diameter	1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21”
Rectangular Sputtering Targets	Width x Length	5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20”
Thickness		0.125”, 0.25”

Tantalum Sputtering Target Material Chemical Composition

Element	R05200 (%,Max)	R05400 (%,Max)
C	0.01	0.01
O	0.015	0.03
N	0.01	0.01
H	0.0015	0.0015
Fe	0.01	0.01
Mo	0.02	0.02
Nb	0.1	0.1
Ni	0.01	0.01
Si	0.005	0.005
Ti	0.01	0.01
W	0.05	0.05

Tantalum Sputtering Target Manufacturing Process

The manufacturing process involves sintering high-purity tantalum powder into blocks and melting them into ingots via a high-vacuum electron beam. These ingots undergo repeated plastic deformation and annealing to produce target blanks with uniform grain structure, which are then welded to backplates and machined into the final product for semiconductor sputtering. Here is the typical production process:

Sintering
Vacuum Electron Beam Melting
Plastic Deformation
Annealing
Metallographic Inspection
Machining
Dimensional Inspection
Cleaning
Final Inspection

Tantalum Sputtering Target Applications

The tantalum sputtering target, often called a bare target, is first soldered to a copper backing plate. It is then used in semiconductor or optical sputtering processes, where tantalum atoms are deposited as oxides onto a substrate to form a sputter coating. The main applications include:

Electronics and Semiconductors: Tantalum targets are widely used as barrier layers in integrated circuit (IC) manufacturing, particularly in copper interconnect technology. Tantalum’s high melting point and low resistance make it an ideal choice for these applications.
Anti-Corrosion Coatings: Due to its exceptional corrosion resistance, tantalum is frequently used to coat chemical equipment and metal surfaces exposed to harsh environments, helping to extend the service life of these materials.
Thin Films for Optics and Photonics: Tantalum targets are employed to create thin films with specific optical properties for use in various optical devices, displays, and sensors.
Medical Devices: With its excellent biocompatibility, tantalum is used to coat medical implants such as bone plates and joint prostheses, reducing the risk of rejection by the body.

Tantalum and Tantalum Alloy

R05200, unalloyed tantalum, electron-beam furnace vacuum-arc melt, or both
R05400, unalloyed tantalum, powder-metallurgy consolidation.
R05255, tantalum alloy, 90 % tantalum, 10 % tungsten, electron-beam furnace of vacuum-arc melt, or both.
R05252, tantalum alloy, 97.5 % tantalum, 2.5 % tungsten, electron-beam furnace or vacuum-arc melt, or both.
R05240, tantalum alloy, 60 % tantalum, 40 % niobium, electron-beam furnace or vacuum-arc melt.

Tantalum Sputtering Target Packaging

The Tantalum Sputtering Target is carefully placed in wooden cases or cartons, with additional support from soft materials, to prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Tantalum Properties

Item	Value
Atomic number	73
Crystal structure	Body centred cubic
Electronic structure	Xe 4f¹⁴ 5d³ 6s²
Valences shown	2,3,4,5
Atomic weight( amu )	180.9479
Thermal neutron absorption cross-section( Barns )	22
Photo-electric work function( eV )	4.1
Natural isotope distribution( Mass No./% )	180/ 0.012
Natural isotope distribution( Mass No./% )	181/ 99.988
Atomic radius – Goldschmidt( nm )	0.147
Ionisation potential( No./eV )	1/ 7.88
Ionisation potential( No./eV )	2/ 16.2

Item	Value
Material condition	Unannealed (Hard)
Material condition	Annealed (Soft)
Poisson’s ratio	0.342
Poisson’s ratio	0.342
Bulk modulus( GPa )	196.3
Bulk modulus( GPa )	196.3
Tensile modulus( GPa )	185.7
Tensile modulus( GPa )	185.7
Hardness – Vickers( kgf mm⁻² )	200
Hardness – Vickers( kgf mm⁻² )	90
Tensile strength( MPa )	760
Tensile strength( MPa )	172-207
Yield strength( MPa )	705
Yield strength( MPa )	310-380

Item	Value
Electrical resistivity( µOhmcm )	13.5@20@20°C
Superconductivity critical temperature( K )	4.47
Temperature coefficient( K⁻¹ )	0.0035@0-100°C
Thermal emf against Pt (cold 0C – hot 100C)( mV )	0.33

Item	Value
Boiling point( °C )	5425
Density( gcm⁻³ )	16.6@20°C

Element	Value
Melting point( °C )	2996
Latent heat of evaporation( J g⁻¹ )	4165
Latent heat of fusion( J g⁻¹ )	174
Specific heat( J K⁻¹ kg⁻¹ )	140@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	57.5@0-100
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	6.5@0-100°C

Download

Tantalum and Alloy Data Sheet_PDS
SAFETY DATA SHEET (SDS) – Tantalum Metal and Alloy

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We will check and get back to you in 24 hours.

To customize your tantalum sputtering target, please provide the following details:

Diameter (for the circular sputtering targets)
Width × Length (for the rectangular sputtering targets)
Thcikness (for the sputtering targets)
Purity of the material
Backing Plate (If bonding service is required, please specify the material and dimensions of the backing plate.）
Quantity of the products you need
Alternatively, you can provide a drawing with your specifications.

Once we have these details, we can provide you with a quote within 24 hours.

We carry a wide variety of tantalum and tantalum alloy products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

DFARS (Defense Federal Acquisition Regulation Supplement) compliance is primarily concerned with the sourcing of materials for defense-related applications in the United States. According to DFARS, certain materials used in defense must be sourced from the United States or qualifying countries.

If you have specific tantalum materials that are subject to DFARS, please let us know in advance and we will confirm.

At Heeger Materials Inc., we take this responsibility seriously. We adhere to all applicable laws and regulations, including Section 1502 of the Dodd-Frank Act. Our company operates with a strict code of ethics and is committed to only partnering with suppliers who share our dedication to responsible sourcing. We support the initiatives and programs aimed at promoting “conflict-free” supply chains and work diligently to ensure that our products meet these standards.

Heeger Materials Inc., established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of tantalum and tantalum alloys. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Heeger Metal offers a wide selection of high-performance sputtering targets made from materials like titanium, copper, aluminum, and rare earth metals. Our custom sputtering targets are precision-engineered to meet the demands of industries such as semiconductor manufacturing, photovoltaic, and electronics. With superior purity and consistency, our sputtering targets deliver exceptional film deposition performance, making them ideal for thin-film coating, sputtering, and PVD (Physical Vapor Deposition) applications.

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